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SUSS MicroTec

SUSS MicroTec introduces XB8 Universal High-Force Wafer Bonder

The XB8 wafer bonder is designed for a wide range of bonding processes and supports substrates with a wafer size of up to 200 mm.
All process parameters can be adapted flexibly according to the requirements, which make the system perfect for use in research and development.
In production, the high level of automation and the sophisticated design of the XB8 ensure a high level of process stability.This makes the XB8 Wafer Bonder perfect for applications from the MEMS, advanced packaging, 3D integration and LED fields.
XB8 offers bond forces up to 100 kN!

Learn more about SUSS XB8 Wafer Bonder

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Events: Meet us!

November 11-12, 2017
Bahrain, Bahrain
Meet us at International Conference on Nanoscience, Nanotechnology & Advanced Materials

November 25-26, 2017
Qatar, Doha
Meet us at International Conference on Nanoscience, Nanotechnology and Advanced Materials

December 4-6, 2017
Dubai, UAE
Meet us at Nanotech Middle East, Dubai World Trade Centre, Dubai, UAE

March 18-21, 2018
Dubai, UAE
Meet us at ArabLab 2018

May 7-8, 2018
Dubai, UAE
Meet us at Middle East Investment Summit 2018

June 4-5, 2018
London, UK
Meet us at 9th Euro Biosensors & Bioelectronics Congress

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Wafer Processing and Training have been updated.
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