SUSS MicroTec introduces XB8 Universal High-Force Wafer Bonder
The XB8 wafer bonder is designed for a wide range of bonding processes and supports substrates with a wafer size of up to 200 mm.
All process parameters can be adapted flexibly according to the requirements, which make the system perfect for use in research and development.
In production, the high level of automation and the sophisticated design of the XB8 ensure a high level of process stability.This makes the XB8 Wafer Bonder perfect for applications from the MEMS, advanced packaging, 3D integration and LED fields.
XB8 offers bond forces up to 100 kN!
Learn more about SUSS XB8 Wafer Bonder
